“Bridging emerging technologies to harsh environment operation”

The Component Modeling & Reliability Competence Center responds to the challenges of transport electrification, which leads to an increase in energy density and electronic miniaturization (digital and power). There is the added necessity of industrial production to massively insert commercial components (COTS) into the supply chain. This is the result of the prowess of consumer electronics, which is spreading to other markets (defense, space, aeronautics and automotive). The main challenge is to control their reliability (failure rate and service life), i.e. their operational RAMS[1] under the particularly severe operating conditions of these sectors. The center’s objective is to build innovative resources and dedicated original expertise to meet the challenges of reliability (predictive and diagnostic), obsolescence management, virtual prototyping and certification.


It is therefore interested in operational reliability[2] to facilitate the insertion into the industrial value chain of innovative components dedicated to different functions: electrical power (non-propulsive and propulsive), digital (calculation and memory), analogue (radio communications and radar detection) and optics (communications and detection), storage and energy sources (batteries, fuel cells and supercapacitors). It is essentially based on the analysis, understanding and modeling of failure mechanisms and malfunctions related to severe operating conditions including electromagnetic compatibility (EMC) and natural radiation immunity.


[1] Reliability, Availability, Maintainability, Safety

[2] Electric components – Reliability – Reference conditions for failure rates and stress models for conversion

R&T Fields

  • Digital components (FinFET, FDSOI etc.) and power (SiC, GaN etc.)
  • Energy source and storage (Batteries, Fuel cell and Supercapacitors)
  • Electronic/electrical assembly and interconnection (QFN, BGA, 3D-TSV etc.)

It includes:

  • Knowledge of failure mechanisms,
  • Knowledge and modeling of particle/matter interactions,
  • The creation of reliability models,
  • The improvement of end-of-life prediction tools (e.g. electronic cards) based on:
    • Existing methods and standards (IEC 61709[1], FIDES, JEDEC etc.),
    • Models that take into account ageing, different failure mechanisms and multiple stresses.

[1] Electric components – Reliability – Reference conditions for failure rates and stress models for conversion

  • Management by digital simulation of component obsolescence.
  • Modeling of equipment and normative test benches in emission and immunity (ISO[1], CISPR25[2], DO160[3]).
  • The creation of EMC models of integrated circuits, investigation tools and design assistance.
  • Obsolescence management / investigation using near-field measurements.

[1] International Organization for Standardization

[2] International Special Committee on Radio Interference

[3] International Technology Roadmap for Semiconductors

  • Knowledge of the mechanisms of interaction between natural radiation and matter.
  • Modeling and estimation of operating margins (e. g. SOA).
  • Development of methodologies for characterizing natural radiation immunity by X-ray and pulsed laser.
  • Modeling Simulation of the sensitivity of technologies (DSM, WBG) to natural radiation.


Head of Components Modeling & Reliability Competence Center
Toulouse Site



  • Expertise (state of the art, technical syntheses, databases and focused/advanced know how).
  • Cost-effective methodologies.
  • Guidelines, strategic view, best practices.
  • Innovative/unique /specific/differentiating technological platforms (customized and trade tailored).
  • Contributions to TRL (technological maturity).
  • Valuation (exploitation and dissemination).
    • Patents.
    • Publications, conferences.
    • Training (seminar, dedicated days, tutorials, workshops, and summer schools).