Publications

622 documents

Maxime Gasse, Damien Grasset, Guillaume Gaudron, Pierre-Yves Oudeyer. Causal Reinforcement Learning using Observational and Interventional Data. 2021. ⟨hal-03465488⟩
Yazan Barazi, Frédéric Richardeau, Frédéric Richardeau, Jean-Michel Reynes. VDS and VGS Depolarization Effect on SiC MOSFET Short-Circuit Withstand Capability Considering Partial Safe Failure-Mode. Energies, 2021, Invited Paper - Special Issue Safety Design and Management of Power Devices including Gate-Drivers, 14 (23), 18 p. ⟨10.3390/en14237960⟩. ⟨hal-03456511⟩
Damien Texier, Antonio Castro Moreno, Daniel Monceau, Daniel Hourcade, Vincent Velay, et al.. Effet de l’épaisseur des échantillons minces sur leur comportement en traction : étude de l’influence de la taille de grain, de la surface libre et de l’état de précipitation pour un superalliage à base de nickel. SF2M 2021 - Journées Annuelles SF2M 2021, Oct 2021, A distance, France. ⟨hal-04171379⟩
Aurélie Bourrat, Bertrand Braunschweig, Loic Cantat, Lionel Cordesses, Georges Hebrail, et al.. Confiance.ai Days 2021 Poster Booklet. 2021. ⟨hal-03687605⟩
Youssouf Drif, Emmanuel Lavinal, Emmanuel Chaput, Pascal Berthou, Boris Tiomela Jou, et al.. Slice Aware Non Terrestrial Networks. 46th IEEE Conference on Local Computer Networks (LCN 2021), Oct 2021, Edmonton (Virtual), United States. ⟨10.1109/LCN52139.2021.9524938⟩. ⟨hal-03273402⟩
Vincent Bedel, Antoine Lonjon, Eric Dantras, Michel Bouquet, Colette Lacabanne. Dynamic electrical and mechanical properties of epoxy/silver nanowires composites. Journal of Applied Polymer Science, 2021, pp.51710. ⟨10.1002/app.51710⟩. ⟨hal-03385668⟩
E. Ben Romdhane, P. Roumanille, A. Guédon-Gracia, S. Pin, P. Nguyen, et al.. From early microstructural evolution to intergranular crack propagation in SAC solders under thermomechanical fatigue. Microelectronics Reliability, 2021, pp.114288. ⟨10.1016/j.microrel.2021.114288⟩. ⟨hal-03375843⟩
Pierre Roumanille, Emna Ben Romdhane, Samuel Pin, Patrick Nguyen, Jean-Yves Delétage, et al.. Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging. Microelectronics Reliability, 2021, pp.114201. ⟨10.1016/j.microrel.2021.114201⟩. ⟨hal-03375916⟩
Ha-Nhi Ngo, Elsy Kaddoum, Marie-Pierre Gleizes, Jonathan Bonnet, Goursolle Anaïs. Life-long Learning System of Driving Behaviors from Vehicle Data Streams. 24th IEEE International Intelligent Transportation Systems Conference (ITSC 2021), Sep 2021, Indianapolis, United States. pp.1132-1139, ⟨10.1109/ITSC48978.2021.9564460⟩. ⟨hal-03561890⟩
Philippe Cuenot, Kevin Delmas, Claire Pagetti. Multi-core processor: Stepping inside the box. ESREL 2021, Sep 2021, Angers, France. ⟨hal-03423962⟩

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