631 documents

  • Mathieu Serrurier, Franck Mamalet, Alberto González-Sanz, Thibaut Boissin, Jean-Michel Loubes, et al.. Achieving robustness in classification using optimal transport with hinge regularization. Conference on Computer Vision and Pattern Recognition, Jun 2021, Virtuel, Canada. ⟨10.1109/CVPR46437.2021.00057⟩. ⟨hal-03033400⟩
  • Siham El Garroussi, Sophie Ricci, M. de Lozzo, N. Goutal, D. Lucor. Towards the reduction of uncertainty in hydraulic modles for better flood forecasting. Simhydro 21, Jun 2021, Nice, France. ⟨hal-04739507⟩
  • Hans Hoffmann Sathler, Tianyu Zhao, François Costa, Bernardo Cougo, Gilles Segond, et al.. Design of three-level flying-capacitor commutation cells with four paralleled 650V/60A GaN HEMTs. 2021 IEEE Applied Power Electronics Conference and Exposition (APEC), Jun 2021, Phoenix, France. pp.2277-2284, ⟨10.1109/APEC42165.2021.9487160⟩. ⟨hal-04461531⟩
  • Youcef Kemari, Guillaume Belijar, Lionel Laudebat, Sombel Diaham, Zarel Valdez-Nava. Partial Discharge Inception Voltage: Precise and Robust Numerical Estimation Based on Extensive Dielectric Spectroscopy Measurements. 2021 IEEE Electrical Insulation Conference (EIC), Jun 2021, Denver, United States. pp.264-268, ⟨10.1109/eic49891.2021.9611381⟩. ⟨hal-03876838v3⟩
  • L Quiroga Cortes, Leonardo Sanches, Camille Bessaguet, Mathieu Chevalier, Colette Lacabanne, et al.. Improving damping capabilities of composites structures by electroactive films containing piezoelectric and conductive fillers. Smart Materials and Structures, 2021, 30 (8), pp.085008. ⟨10.1088/1361-665X/ac0670⟩. ⟨hal-03371154⟩
  • E. Ben Romdhane, P. Roumanille, A. Guedon-Gracia, S. Pin, P. Nguyen, et al.. Early microstructural indicators of crack initiation in lead-free solder joints under thermal cycling. 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), Jun 2021, San Diego, United States. pp.2293-2301, ⟨10.1109/ECTC32696.2021.00359⟩. ⟨hal-03336972⟩
  • Sébastien Serpaud, Alexandre Boyer, Sonia Ben Dhia, Fabio Coccetti. Fast and Accurate Near-Field Measurement Method using Sequential Spatial Adaptive Sampling (SSAS) Algorithm. IEEE Transactions on Electromagnetic Compatibility, 2021, 63 (3), pp.858-869. ⟨10.1109/TEMC.2020.3025547⟩. ⟨hal-02967998⟩
  • C. Ngom, Vincent Pouget, M. Zerarka, F. Coccetti, Antoine Touboul, et al.. Backside Laser Testing of Single-Event Effects in GaN-on-Si Power HEMTs. IEEE Transactions on Nuclear Science, 2021, 68 (8), pp.1642-1650. ⟨10.1109/TNS.2021.3081485⟩. ⟨hal-03428144⟩
  • Yandika Sirgabsou, Claude Baron, Lorenzo Grenier, Laurent Pahun, Philippe Esteban. L’ingénierie dirigée par les modèles pour assurer la sécurité des logiciels embarqués en automobile. 14ème Conférence Internationale Génie Industriel CIGI-QUALITA, May 2021, Grenoble, France. ⟨hal-03232108⟩
  • Yazan Barazi, Nicolas C. Rouger, Frédéric Richardeau. Comparison between i g integration and v gs derivation methods dedicated to fast short-circuit 2D diagnosis for wide bandgap power transistors. Mathematics and Computers in Simulation, 2021, 183, pp.Pages 171-186. ⟨10.1016/j.matcom.2020.05.011⟩. ⟨hal-02972905⟩
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