Centre des congrès Pierre Baudis, 11 espl. Compans Caffarelli, 31000, Toulouse
The 19th EuroSimE – the International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems – is organised by IRT Saint Exupéry and from IEEE-EPS (Electronics Packaging Society) for publishing accepted papers in IEEE Xplore Digital Library.
The conference will address the results of fundamental research and industrial applications for thermal, mechanical and multiphysics simulation and experiments of micro/nano-electronics and microsystems. For this edition, a new topic is introduced, vibration : methods to derive the endurance strength under vibration, FE methods to derive the dynamic response under vibration, material characterization and modeling for FE models under vibration, vibration load profile derivation and transfer to FE models.
Free (for conference attendants) short courses will be offered for professional training on April 15, 2018. Three days of technical sessions (April 16–18, 2018) for oral and poster presentations are planned, in parallel with an exhibition of suppliers of experimental characterization equipment, and simulation and optimization softwares, demonstrating their latest features.
The best papers will be selected for publishing in Elsevier magazines on Microelectronics Reliability and Mechatronics. A selection ofextended papers will be published in a special issue on Modeling, Simulation and Multi-Physical Experimentationof Micro and Nanosystems of a reknown journal of microtechnologies.